CA1285998C - Automatic soldering apparatus - Google Patents
Automatic soldering apparatusInfo
- Publication number
- CA1285998C CA1285998C CA000548017A CA548017A CA1285998C CA 1285998 C CA1285998 C CA 1285998C CA 000548017 A CA000548017 A CA 000548017A CA 548017 A CA548017 A CA 548017A CA 1285998 C CA1285998 C CA 1285998C
- Authority
- CA
- Canada
- Prior art keywords
- work
- fixture
- works
- soldering
- support frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 107
- 230000007246 mechanism Effects 0.000 claims abstract description 69
- 238000011068 loading method Methods 0.000 claims abstract description 29
- 238000012546 transfer Methods 0.000 claims description 19
- 238000000605 extraction Methods 0.000 claims description 17
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- 238000001179 sorption measurement Methods 0.000 claims description 15
- 238000011084 recovery Methods 0.000 claims description 9
- 238000004873 anchoring Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000000875 corresponding effect Effects 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUKUURHRXDUEBC-KAYWLYCHSA-N Atorvastatin Chemical compound C=1C=CC=CC=1C1=C(C=2C=CC(F)=CC=2)N(CC[C@@H](O)C[C@@H](O)CC(O)=O)C(C(C)C)=C1C(=O)NC1=CC=CC=C1 XUKUURHRXDUEBC-KAYWLYCHSA-N 0.000 description 1
- 101100493711 Caenorhabditis elegans bath-41 gene Proteins 0.000 description 1
- 101150007148 THI5 gene Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- 229940102098 revolution Drugs 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/047—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Specific Conveyance Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP288,490.86 | 1986-12-03 | ||
| JP61288490A JPS63140763A (ja) | 1986-12-03 | 1986-12-03 | 自動はんだ付け装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1285998C true CA1285998C (en) | 1991-07-09 |
Family
ID=17730884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000548017A Expired - Fee Related CA1285998C (en) | 1986-12-03 | 1987-09-28 | Automatic soldering apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US4787550A (en]) |
| JP (1) | JPS63140763A (en]) |
| BE (2) | BE1001750A5 (en]) |
| CA (1) | CA1285998C (en]) |
| DE (1) | DE3730434A1 (en]) |
| GB (1) | GB2199782B (en]) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5611475A (en) * | 1986-07-11 | 1997-03-18 | Sun Industrial Coatings Private Ltd. | Soldering apparatus |
| JPH0680605B2 (ja) * | 1987-11-28 | 1994-10-12 | 株式会社村田製作所 | 電子部品チップ保持治具および電子部品チップのメタライズ面への金属コーティング方法 |
| US4964560A (en) * | 1988-10-28 | 1990-10-23 | Wharff Charles R | Non-dedicated pallet assembly for wave soldering packaged integrated circuits |
| US4871106A (en) * | 1988-10-28 | 1989-10-03 | Wharff Charles R | Non-dedicated pallet assembly for wave soldering packaged integrated circuits |
| EP0438615A1 (de) * | 1990-01-23 | 1991-07-31 | Thyssen Industrie Ag Maschinenbau | Einrichtung zum Verbinden von mindestens zwei Blechen durch wenigstens eine durch eine Laserstrahlschweissvorrichtung hergestellte Schweissnaht |
| US5379943A (en) * | 1993-10-19 | 1995-01-10 | Ncr Corporation | Hot air circulation apparatus and method for wave soldering machines |
| US5560537A (en) * | 1995-04-11 | 1996-10-01 | Vlt Corporation | Automatic soldering |
| US6448169B1 (en) * | 1995-12-21 | 2002-09-10 | International Business Machines Corporation | Apparatus and method for use in manufacturing semiconductor devices |
| US6090452A (en) * | 1998-09-18 | 2000-07-18 | Rocky Top Wood Perservers, Inc. | Conveying device for pressure treating wood |
| DE50214298D1 (de) * | 2001-06-20 | 2010-05-06 | Alstom Technology Ltd | Lötverbindung und Verfahren zur Herstellung einer Lötverbindung |
| US6554174B1 (en) * | 2001-12-05 | 2003-04-29 | Manuel Aceves | Integrated electronics workstation |
| US20040016113A1 (en) * | 2002-06-19 | 2004-01-29 | Gerald Pham-Van-Diep | Method and apparatus for supporting a substrate |
| US7028391B2 (en) * | 2002-06-19 | 2006-04-18 | Speedline Technologies, Inc. | Method and apparatus for supporting a substrate |
| US6935549B2 (en) * | 2003-05-23 | 2005-08-30 | Medtronic, Inc. | Brazing fixtures and methods for fabricating brazing fixtures used for making feed-through assemblies |
| PL2029307T3 (pl) * | 2006-05-29 | 2011-07-29 | Kirsten Soldering Ag | Urządzenie do lutowania z modułami do lutowania i co najmniej jedną mobilną i wymienną stacją do lutowania wstawianą w moduł do lutowania; odpowiadająca stacja rezerwowa (stand-by) |
| DE202009012006U1 (de) * | 2009-09-04 | 2011-02-03 | TRUMPF Maschinen Grüsch AG | Auflagedorn zum Positionieren des Auflagedornes auf einer Werkstückauflage |
| US8770463B1 (en) | 2013-05-20 | 2014-07-08 | Western Digital Technologies, Inc. | Head gimbal assembly carrier with adjustable protective bar |
| CN106817853A (zh) * | 2015-11-30 | 2017-06-09 | 鸿富锦精密电子(郑州)有限公司 | 夹具 |
| CN106341958B (zh) * | 2016-09-14 | 2018-10-12 | 重庆市益源捷科技有限公司 | Pcb板焊接治具 |
| CN107598324B (zh) * | 2017-10-23 | 2024-02-20 | 中国电子科技集团公司第四十三研究所 | 一种封装产品预热装置 |
| CN108655530A (zh) * | 2018-04-23 | 2018-10-16 | 格力电器（武汉）有限公司 | 一种焊锡工装 |
| CN113649666B (zh) * | 2021-10-20 | 2021-12-14 | 南通东野光电科技有限公司 | 一种pcb板生产用元件焊接设备 |
| CN116460475A (zh) * | 2023-05-15 | 2023-07-21 | 中船海洋动力部件有限公司 | 一种用于船用柴油机机架横梁部件的自动化焊接装置 |
| CN116493854B (zh) * | 2023-06-26 | 2023-09-08 | 唐山今创四海特种复合材料有限公司 | 一种轨道交通车辆部件组装用支撑模具 |
| CN116997096B (zh) * | 2023-09-26 | 2023-12-26 | 山西星心半导体科技有限公司 | 一种led灯珠的贴片装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4849231U (en]) * | 1971-10-13 | 1973-06-28 | ||
| JPS50145864A (en]) * | 1974-05-14 | 1975-11-22 | ||
| JPS5127845A (ja) * | 1974-09-03 | 1976-03-09 | Koki Kk | Handazukesochi |
| JPS5159054A (ja) * | 1974-11-20 | 1976-05-22 | Tamura Seisakusho Kk | Jidohandazukesochi |
| CH641708A5 (de) * | 1979-11-02 | 1984-03-15 | Sinter Ltd | Vorrichtung zum aufbringen von lot auf leiterplatten. |
| DE3039075C2 (de) * | 1980-10-16 | 1982-07-22 | WLS Karl-Heinz Grasmann Weichlötanlagen- und Service, 6985 Stadtprozelten | Lötmaschine |
| FR2495884A1 (fr) * | 1980-12-05 | 1982-06-11 | Lignes Telegraph Telephon | Dispositif de reception d'au moins une plaquette, notamment de circuit imprime, et utilisation d'un tel dispositif |
| DE3111809C2 (de) * | 1981-03-25 | 1985-05-15 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Verfahren und Vorrichtung zum maschinellen Löten von Werkstücken |
| US4512510A (en) * | 1982-10-26 | 1985-04-23 | Nihon Den-Nitsu Keiki Co. Ltd. | Printed circuit board soldering apparatus |
| US4558812A (en) * | 1984-11-07 | 1985-12-17 | At&T Technologies, Inc. | Method and apparatus for batch solder bumping of chip carriers |
| GB8520844D0 (en) * | 1985-08-20 | 1985-09-25 | Sun Ind Coatings | Holding electrical/electronic components |
| JPS62168668A (ja) * | 1986-01-18 | 1987-07-24 | Takaki Seisakusho Kk | Ｉｃホルダ− |
| US4700935A (en) * | 1986-02-07 | 1987-10-20 | Winslow Russell T | Fixture for wave soldering packaged integrated circuits |
-
1986
- 1986-12-03 JP JP61288490A patent/JPS63140763A/ja active Granted
-
1987
- 1987-08-20 US US07/087,675 patent/US4787550A/en not_active Expired - Fee Related
- 1987-08-24 GB GB8719962A patent/GB2199782B/en not_active Expired - Fee Related
- 1987-09-10 DE DE19873730434 patent/DE3730434A1/de active Granted
- 1987-09-28 CA CA000548017A patent/CA1285998C/en not_active Expired - Fee Related
- 1987-10-01 BE BE8701115A patent/BE1001750A5/fr not_active IP Right Cessation
-
1988
- 1988-06-03 US US07/201,901 patent/US4846390A/en not_active Expired - Fee Related
-
1989
- 1989-07-04 BE BE8900728A patent/BE1002205A3/fr active
Also Published As
| Publication number | Publication date |
|---|---|
| US4846390A (en) | 1989-07-11 |
| GB8719962D0 (en) | 1987-09-30 |
| DE3730434C2 (en]) | 1989-05-03 |
| JPH0469506B2 (en]) | 1992-11-06 |
| BE1002205A3 (fr) | 1990-10-09 |
| GB2199782A (en) | 1988-07-20 |
| BE1001750A5 (fr) | 1990-02-27 |
| JPS63140763A (ja) | 1988-06-13 |
| US4787550A (en) | 1988-11-29 |
| DE3730434A1 (de) | 1988-06-09 |
| GB2199782B (en) | 1990-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |